Beam imaging sensor and method for using same

ABSTRACT

The present invention relates generally to the field of sensors for beam imaging and, in particular, to a new and useful beam imaging sensor for use in determining, for example, the power density distribution of a beam including, but not limited to, an electron beam or an ion beam. In one embodiment, the beam imaging sensor of the present invention comprises, among other items, a circumferential slit that is either circular, elliptical or polygonal in nature. In another embodiment, the beam imaging sensor of the present invention comprises, among other things, a discontinuous partially circumferential slit. Also disclosed is a method for using the various beams sensor embodiments of the present invention.

RELATED APPLICATION DATA

This patent application is a continuation-in-part of and claims priority to U.S. patent application Ser. No. 13/826,907 filed Mar. 14, 2013 and titled “Beam Imaging Sensor,” which itself is a non-provisional of and claims priority to U.S. Provisional Patent Application No. 61/646,627 filed May 14, 2012 and titled “Beam Imaging Sensor.” The complete texts of these applications are hereby incorporated by reference as though fully set forth herein in its entirety.

GOVERNMENT RIGHTS

The United States Government may have rights to this invention pursuant to contract number DE-AC11-07PN38361(A) between the United States Department of Energy and Babcock & Wilcox Nuclear Operations Group, Inc.

FIELD AND BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to the field of sensors for beam imaging and, in particular, to a new and useful beam imaging sensor for use in determining, for example, the power density distribution of a beam including, but not limited to, an electron beam or an ion beam. In one embodiment, the beam imaging sensor of the present invention comprises, among other items, a circumferential slit that is either circular, elliptical or polygonal in nature. In another embodiment, the beam imaging sensor of the present invention comprises, among other things, a discontinuous partially circumferential slit. Also disclosed is a method for using the various beams sensor embodiments of the present invention.

2. Description of the Related Art

Electron beams are considered to be the most precise and clean method available for welding thick sections of materials. Unfortunately, electron beams suffer one critical deficiency, namely the repeatability of focusing the beam to a known power density. Without the ability to reliably reproduce the power distribution in an electron beam, weld quality cannot be guaranteed. This problem is exacerbated by the fact the many welds are made over a period of time and with different welding operators. Further complications arise when welds are developed on one machine than transferred to a different machine for production. Various electron beam diagnostic methods have been developed that, at some level, enable the characterization of the power density distribution in high power electron beams. Such diagnostic methods are exemplified by U.S. Pat. Nos. 5,382,895; 5,468,966; 5,554,926; 5,583,427; 6,300,755; 7,288,772; 7,348,568; 7,378,830; and 7,902,503. However, the methods and sensors disclosed therein all suffer from a number of drawbacks. While not wishing to be bound to any one drawback, some, if not all, of the prior art sensors suffer from thermal load drawbacks that cause the sensors of the prior art to fail at lower energy levels (e.g., 5 kW).

Given the above, a need exists for a beam imaging sensor that provides superior functionality and accuracy while still being able to withstand beam energy settings in excess of 5 kW.

SUMMARY OF THE INVENTION

The present invention relates generally to the field of sensors for beam imaging and, in particular, to a new and useful beam imaging sensor for use in determining, for example, the power density distribution of a beam including, but not limited to, an electron beam or an ion beam. In one embodiment, the beam imaging sensor of the present invention comprises, among other items, a circumferential slit that is either circular, elliptical or polygonal in nature. In another embodiment, the beam imaging sensor of the present invention comprises, among other things, a discontinuous partially circumferential slit. Also disclosed is a method for using the various beams sensor embodiments of the present invention.

Accordingly, one aspect of the present invention is drawn to a beam imaging sensor comprising: a cylindrically-shaped sensor body, wherein the sensor body has a top end and a bottom end, the top end having at least one channel formed therein; a Faraday cup located within the at least one channel, the Faraday cup being positioned to receive at least a portion of an electron, or ion, beam; an inner slit disc and an outer slit disc positioned at the top end of the least one channel so as to be positioned above the Faraday cup, the inner and outer slit discs being able to nest together to form a slit there between and where the slit so formed permits the passage of at least a portion of an electron, or ion, beam to the Faraday cup located there below; and at least one conductive lead in electrical communication with the Faraday cup, the at least one conductive lead being able to conduct an electrical signal generated by the portion of the beam that comes into contact with the Faraday cup.

In yet another aspect of the present invention, there is provided a beam imaging sensor comprising: a cylindrically-shaped sensor body, wherein the sensor body has a top end and a bottom end, the top end having at least one channel formed therein; a cylindrically-shaped electronics enclosure, wherein the electronics enclosure has a top end and a bottom end, the top end of the electronics enclosure being coupled to the bottom end of the sensor body; a Faraday cup located within the at least one channel, the Faraday cup being positioned to receive at least a portion of an electron, or ion, beam; an inner slit disc and an outer slit disc positioned at the top end of the least one channel so as to be positioned above the Faraday cup, the inner and outer slit discs being able to nest together to form a slit there between and where the slit so formed permits the passage of at least a portion of an electron, or ion, beam to the Faraday cup located there below; and at least one conductive lead in electrical communication with the Faraday cup, the at least one conductive lead being able to conduct an electrical signal generated by the portion of the beam that comes into contact with the Faraday cup.

In yet another aspect of the present invention, there is provided a beam imaging sensor comprising: a cylindrically-shaped sensor body, wherein the sensor body has a top end and a bottom end, the top end having at least one channel formed therein; a cylindrically-shaped electronics enclosure, wherein the electronics enclosure has a top end and a bottom end, the top end of the electronics enclosure being coupled to the bottom end of the sensor body; a cylindrically-shaped clamp ring body and a cylindrically-shaped lower clamp ring, wherein the clamp ring body and the clamp ring are coupled to one another and together have a top end and a bottom end, the top end of the coupled structure being coupled to the bottom end of the electronics enclosure; a Faraday cup located within the at least one channel, the Faraday cup being positioned to receive at least a portion of an electron, or ion, beam; an inner slit disc and an outer slit disc positioned at the top end of the least one channel so as to be positioned above the Faraday cup, the inner and outer slit discs being able to nest together to form a slit there between and where the slit so formed permits the passage of at least a portion of an electron, or ion, beam to the Faraday cup located there below; and at least one conductive lead in electrical communication with the Faraday cup, the at least one conductive lead being able to conduct an electrical signal generated by the portion of the beam that comes into contact with the Faraday cup.

In yet another aspect of the present invention, there is provided a beam imaging sensor comprising: a cylindrically-shaped sensor body, wherein the sensor body has a top end and a bottom end, the top end having at least one channel formed therein; a Faraday cup located within the at least one channel, the Faraday cup being positioned to receive at least a portion of an electron, or ion, beam; a plurality of sets inner and outer slit plates positioned at the top end of the cylindrically-shaped sensor body so as to be positioned above the Faraday cup, wherein each set of the plurality of sets inner and outer slit plates are positioned to form a slit there between and where the slit so formed permits the passage of at least a portion of an electron, or ion, beam to the Faraday cup located there below; and at least one conductive lead in electrical communication with the Faraday cup, the at least one conductive lead being able to conduct an electrical signal generated by the portion of the beam that comes into contact with the Faraday cup, wherein the plurality of sets of inner and outer slit plates form a slit that is at least a discontinuous partially circumferential slit.

In yet another aspect of the present invention, there is provided a beam imaging sensor as shown and described herein, and/or a beam imaging sensor as shown and described in any of the Figures attached hereto. In still another aspect of the present invention, there is provided a method of utilizing a beam imaging sensor as shown and described herein.

In yet another aspect of the present invention, there is provided a method for profiling an electron, or ion, beam using a beam imaging sensor comprising: (A) providing a beam imaging sensor having at least one slit; (B) providing a suitable electron, or ion, beam to be profiled; (C) providing a digital deflection control system and coil designed to deflect the electron, or ion, beam in a desired geometric path so as to sweep the electron, or ion, beam across the at least one slit in a straight path regardless of slit shape or geometry; (D) sweeping the electron, or ion, beam across at least one portion of the at least one slit of the sensor so as to generate data from the sensor; and (E) subjecting such data to at least one processing step using at least one computer so as to determine at least one electron, or ion, beam parameter.

In yet another aspect of the present invention, there is provided a method for profiling an electron, or ion, beam using a beam imaging sensor comprising: (a) providing a beam imaging sensor comprising: a cylindrically-shaped sensor body, wherein the sensor body has a top end and a bottom end, the top end having at least one channel formed therein; a Faraday cup located within the at least one channel, the Faraday cup being positioned to receive at least a portion of an electron, or ion, beam; either: (i) a plurality of sets inner and outer slit plates positioned at the top end of the cylindrically-shaped sensor body so as to be positioned above the Faraday cup, wherein each set of the plurality of sets inner and outer slit plates are positioned to form a slit there between and where the slit so formed permits the passage of at least a portion of an electron, or ion, beam to the Faraday cup located there below; or (ii) an inner slit disc and an outer slit disc positioned at the top end of sensor body so as to be positioned above the Faraday cup, the inner and outer slit discs being able to nest together to form a slit there between and where the slit so formed permits the passage of at least a portion of an electron, or ion, beam to the Faraday cup located there below; and at least one conductive lead in electrical communication with the Faraday cup, the at least one conductive lead being able to conduct an electrical signal generated by the portion of the beam that comes into contact with the Faraday cup, wherein the plurality of sets of inner and outer slit plates, or the inner and outer slit discs, form a slit; (b) providing a suitable electron, or ion, beam to be profiled; (c) providing a digital deflection control system and coil designed to deflect the electron, or ion, beam in a desired geometric path so as to sweep the electron, or ion, beam across the slit in a straight path regardless of slit shape or geometry; (d) sweeping the electron, or ion, beam across at least one portion of a discontinuous partially circumferential slit, or a circumferential slit, of the sensor so as to generate data from the sensor; and (e) subjecting such data to at least one processing step using at least one computer so as to determine at least one electron, or ion, beam parameter.

The various features of novelty which characterize the invention are pointed out with particularity in the claims annexed to and forming a part of this disclosure. For a better understanding of the invention, its operating advantages and specific benefits attained by its uses, reference is made to the accompanying drawings and descriptive matter in which exemplary embodiments of the invention are illustrated.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a partial cut-away illustration of a beam imaging sensor of the prior art;

FIG. 2 is a partial cut-away illustration of a beam imaging sensor according to one embodiment of the present invention;

FIG. 3 is a partial close-up illustration of the top portion of the beam imaging sensor of FIG. 2;

FIG. 4 is a partial top-down illustration of a beam imaging sensor according to another embodiment of the present invention;

FIG. 5 is a partial top-down illustration of a beam imaging sensor according to still another embodiment of the present invention; and

FIG. 6 is a close up illustration of a beam imaging sensor of the present invention containing a detailed illustration of the beam path through the sensor;

FIG. 7 is a close-up illustration of the MFC portion of a beam imaging sensor according to the present invention;

FIG. 8 is a close-up illustration of the MFC portion of a beam imaging sensor illustrating one possible design layout for the MFC portion of a beam imaging sensor according to one embodiment of the present invention;

FIG. 9 is a close-up illustration of a side portion of beam sensor 300 illustrating an alternative attachment means for securing outer clamp ring 322 to sensor body 302;

FIG. 10 is a close-up illustration of a side portion of beam sensor 300 illustrating another alternative attachment means for securing outer clamp ring 322 to sensor body 302;

FIG. 11 is a close-up cut away illustration of beam sensor 300 illustrating one possible attachment means for securing one or more clamp arms to sensor body 302 so as to facilitate securing outer clamp ring 322 to sensor body 302;

FIG. 12 is a close-up illustration of a portion of beam sensor 300 illustrating an alternative attachment means for securing inner clamp ring 320 to sensor body 302;

FIG. 13 is a partial top-down illustration of a portion of a beam imaging sensor according to still another embodiment of the present invention; and

FIG. 14 is a partial top-down illustration of a portion of a beam imaging sensor according to still yet another embodiment of the present invention;

FIGS. 15 through 17 are partial illustration of another set of nesting slit discs according to still yet another embodiment of the present invention;

FIG. 18 is a partial perspective illustration of yet another embodiment for a top portion of a beam sensor according to the present invention;

FIG. 19 is a partial top-down illustration of a portion of the beam imaging sensor according to the embodiment of FIG. 18;

FIGS. 20A through 20D are partial illustrations showing how a beam to be measured is swept across a slit in the various embodiments of the beam imaging sensors of the present invention;

FIG. 21 is an illustration of one embodiment of an electron gun that generates an electron beam to be measured by the one or more beam imaging sensors of the present invention;

FIG. 22 is an illustration detailing various factors, or parameters, of an electron beam welding process that must be considered when utilizing such a process to weld one or more workpieces;

FIG. 23 is an illustration detailing various factors that can affect maximum deflection distance that can be obtained for one embodiment of a beam imaging sensor according to the present invention;

FIG. 24 is an illustration detailing one exemplary beam sweeping path provided through the use of a programmable digital deflection control system and coil according to one embodiment of the present invention; and

FIG. 25 is an illustration of a manner in which a digital deflection control system and coil moves through a series of points to get from Point A to Point B.

DESCRIPTION OF THE INVENTION

While the present invention will be described in terms of an electron beam, or ion beam, the present invention is not limited thereto. Rather, the beam imaging sensor of the present invention can be utilized in any situation where one wants to ascertain the power density distribution of a beam of energy.

As noted above, the present invention relates generally to the field of sensors for beam imaging and, in particular, to a new and useful beam imaging sensor for use in determining, for example, the power density distribution of a beam including, but not limited to, an electron beam or an ion beam. In one embodiment, the beam imaging sensor of the present invention comprises, among other items, a circumferential slit that is either circular, elliptical or polygonal (be it a regular polygon or an irregular polygon) in nature. In another embodiment, the beam imaging sensor of the present invention comprises, among other things, a discontinuous partially circumferential slit. Also disclosed is a method for using the various beams sensor embodiments of the present invention. As utilized herein the word “circumferential” denotes the location and/or positioning of the slit in the present invention relative various other parts of the beam imaging sensor. The word “circumferential” does not however limit the geometrical shape of the slit in the beam imaging sensor of the present invention.

Turning to FIG. 1, FIG. 1 is an illustration of a prior art beam imaging sensor 102 having a modified Faraday cup (MFC). As can be seen in FIG. 1, the modified Faraday cup (MFC) imaging sensor 102 is subjected to a high power beam 111. As illustrated in FIG. 1, MFC sensor 102 includes a slit disk assembly 201, a conducting disk 203 located below the slit disk assembly 201, a Faraday cup assembly 206 located below the conducting disk 203, and a start-stop target 214 located proximate the slit disk assembly 201. A multiplicity of circumferential radial slits 216 and a trigger probe 117 are located in the slit disk assembly 201. A desired number of circumferential radial slits 212 are located in the conducting disk 203. In order to keep the MFC sensor 102 from over-heating during use, a heat sink is placed in close proximity to the components. An active cooling system, using water or other cooling fluid, can be further integrated into the heat sink.

When utilized in a diagnostic system as known to those of skill in the art, sensor 102 provides a manner by which to measure the power density distribution of a high power and high intensity electron, or ion, beam 111. During operation, the beam 111 is rotated about the central point of the slit disk assembly 201 over the aligned radial slits 216 and 212. Electrons or ions pass through the aligned radial slits 216 and 212 and are intercepted by the Faraday cup assembly 206 where they are detected and a signal is sent to the measuring and data acquisition system to measure the profile of the beam. Computed tomography can then be used to reconstruct the power density distribution of the beam 111.

In order to prevent damage to the tungsten slit disk assembly 201, the time over which the beam 111 comes in contact with the tungsten slit disk assembly 201 is reduced. In order to do this, the target block 214 is located to the side of the tungsten slit disk assembly 201. The target block 214 is made of a refractory metal. The beam 111 is first directed onto the target block 214 as illustrated in FIG. 1, and then the beam is translated to the radial slits 216, where it is translated in a circle indicated at 111 a for a minimum number of rotations and then translated back onto the target block 214. The trigger probe 117 initiates the overall measuring system (not pictured). This is accomplished by trigger probe 117 sensing scattered electrons produced as the beam 111 passes through a region between slits 216 and directly in front of trigger probe 117.

The overall diagnostic system, an example of one such overall system can be found in U.S. Pat. No. 7,348,568, provides a system for rapidly measuring the power density distribution of an electron or an ion beam. The sensing system permits capture of various beam profiles in a fraction of a second as the beam is moved in a circular pattern over MFC sensor 102.

As noted above, the modified Faraday cup (MFC) sensor 102 includes a slit disk assembly 201, a space 202 between the slit disk assembly and conducting disk, a conducting disk 203, a space 204 between the conducting disk and the Faraday cup assembly, a spacer ring 205, a Faraday cup assembly 206, a space 207 between the Faraday cup assembly and the bottom plate, a spacer ring 208, a bottom plate 209, a heat sink 210, a hole 211 in the conducting disk, circumferential radial slits 212 in the conducting disk, a hole 213 in the slit disk assembly, a start-stop target 214, a mounting ring 215, a circumferential radial slits 216 in the slit disk assembly, and a trigger probe 117.

The slit disk assembly 201 of the MFC sensor 102 is made of an electrically conductive refractory material. Refractory materials are required to minimize damage to the slit disk assembly 201 by the high power beam 111. This material should also have a high average atomic number to intercept the beam 111, and be sufficiently thick to prevent the beam 111 from penetrating through to the underlying layers. In the embodiment shown in FIG. 1, the slit disk assembly 201 is made of tungsten.

During operation, the beam 111 is rotated about the central point of the slit disk assembly 201 over the aligned radial slits 216 and 212. Electrons or ions pass through the aligned radial slits 216 and 212 and are intercepted by the Faraday cup assembly 206 where they are detected and a signal is sent to the measuring and data acquisition system to measure the profile of the beam. Computed tomography can then be used to reconstruct the power density distribution of the beam 111.

As noted above, a system for characterizing a beam is operated by directing the beam onto the start/stop target; directing the beam onto the slit disk assembly; translating the beam to the radial slits wherein the beam enters the radial slits and conducting disk radial slits where it is detected by the Faraday cup; translating the beam onto the start/stop target.

Turning to FIGS. 2 and 3, FIGS. 2 and 3 illustrate a beam imaging sensor 300 according to one embodiment of the present invention. In one embodiment, beam imaging and/or profiling sensor 300 comprises an annular-shaped (or cylindrically-shaped) sensor body 302 having an inner diameter 304, an outer diameter 306 and a notched channel 308 formed therein. Notched channel 308 is designed to receive a modified Faraday cup (MFC) 310. As illustrated in FIG. 2, MFC 310 can be formed from one or more pieces of conductive material such as a conductive metal or conductive metal alloy (e.g., conductive metals such as copper, silver, gold, platinum, aluminum, etc.; or conductive metal alloys that contain one or more of copper, silver, gold, platinum, aluminum etc.). In another embodiment, the one or more metal pieces (e.g., 312 and 314) that form MFC 310 are formed from a brazed metal such as copper. As can be seen from FIG. 2, MFC 310 is held in place with at least one fastener 316 that is insulated via a corresponding fastener insulator 316 a. MFC 310 is also in contact with MFC lead 318 that is formed from a conductive material similar to, or identical to, the material utilized to form MFC 310. MFC 310 is insulated from contact with the bottom of notched channel 308 via MFC insulator 319. As can be seen in FIG. 2, an opening, or hole, 321 is located in MFC insulator 319 to permit MFC lead 318 to pass there through and come into electrically conductive contact with MFC 310. In one embodiment, the one or more fastener insulators 316 a and the MFC insulator 319 are independently formed from any material that can act as an electrical insulator and prevent the unwanted transmission of an electrical current. Suitable materials include, but are not limited to, one or more organic-based or inorganic-based insulating compounds, glass-epoxy insulators (e.g., G-10), ceramic insulators, or any combination of two or more thereof. Suitable insulating compounds include, but are not limited to, phenolic resin-based insulating compounds, polytetrafluoroethylene-based insulating compounds (i.e., Teflon®-based insulating compounds, polyoxymethylene (a.k.a., acetal, polyacetal and/or polyformaldehyde such as Delrin®), alumina insulating compounds (e.g., high purity alumina or alumina silicate), silicon-based insulating compounds (e.g., silicon nitride), insulating glass compounds (e.g., machineable borosilicate glasses such as Macor®).

As can be seen from FIG. 2 and/or FIG. 3, the top portion of sensor body 302 is threaded on both its interior cylindrical surface and exterior cylindrical surface in order to receive inner clamp ring 320 and outer clamp ring 322, respectively. It should be noted that the present invention is not limited to an embodiment having only threaded portions to retain inner clamp ring 320 and outer clamp ring 322. Rather, any suitable retention system and/or method can be utilized to secure inner clamp ring 320 and outer clamp ring 322 to the top portion of sensor body 302. Such suitable methods include, but are not limited to, compression fits, welds, adhesives, at least one physical attachment means (e.g., screws, rivets, bolts, tensioners, clamps, etc.), or any combination of two or more thereof. Regarding inner clamp ring 320 and outer clamp ring 322, these clamp rings are designed to secure concentrically nesting inner slit disc 324 and outer slit disc 326 in a set of notches and/or ledges 328 and 330 (or even in another embodiment channels) formed in the top edge surface of sensor body 302. As will be discussed in detail below with regard to various alternative embodiments of the present invention, only the inner edge of inner slit disc 324 and outer edge of outer slit disc 326 need to be circular in nature. The outer edge of inner slit disc 324 and the inner edge of outer slit disc 326 can be of any desirable geometric shape so long as these two edges match one another and permit nesting of the inner and outer slit discs 324 and 326, respectively, to yield and/or form a desirable gapped slit 332 as discussed in detail below.

As can be seen in FIGS. 2 and 3, positioned approximately equidistant between the inner diameter 304 and the outer diameter 306 of sensor body 302 is a circular circumferential slit 332 formed by the inner edge 334 of outer slit disc 326 and the outer edge 336 of inner slit disc 324. Slit 332 extends completely through the thickness of slit discs 324 and 326. Slit 332 permits energy from the ion/electron beam, when translated across the slit, to pass through the slit into MFC 310 thereby causing MFC 310 to produce a voltage signal which is proportional to the electrical current passing through slit 332 and into MFC 310. The electrical signal from MFC 310 is used to characterize the shape and power distribution of the subject beam via a signal captured and transmitted via MFC lead 318 through one or more wires (not pictured) attached to MFC lead 318. The one or more wires from MCF lead 318 are connected at the other end to a computer (not pictured) running suitable software as known to those of skill in the art for interpreting the signal/energy data captured by MFC 310. In one embodiment, the one or more wires from MFC lead 318 can be channeled as illustrated by the arrow of FIG. 2. However, the present invention is not limited to just this wiring route. In another embodiment, as is illustrated in FIGS. 2 and 3, slit 332 is formed so as to have a corresponding set of relief angles on the underside edge of slit 332. This can be seen in FIGS. 2 and 3 as the bottom portion of slit 332 is slight wider (or more open) than the top of slit 332. It should be noted that the present invention is not limited to just this type of top to bottom slit profile. Rather, any type of slit profile from top to bottom could be utilized herein. As such, some non-limiting examples include, but are not limited to, a slit 332 that is the same width from top to bottom, a slit 332 that is wider at the top and narrower at the bottom, or a slit 332 that is wider at the bottom and narrower at the top (i.e., similar to what is illustrated in FIGS. 2 and 3).

Turning to the remaining portions of beam imaging sensor 300, the bottom portion of sensor body 302 is formed to operatively couple to an annular-shaped (or cylindrically-shaped) electronics enclosure 338. As can be seen from FIG. 2, the bottom portion of sensor body 302 is fitted to electronics enclosure 338 via a flange 340 on the bottom edge of sensor body 302 and a lip 342 in the top edge of electronics enclosure 338. In another embodiment, sensor body 302 and electronics enclosure 338 can be further secured to another via an adhesive placed between flange 340 and lip 342. In still another embodiment, a compression fitting between flange 340 and lip 342 could be utilized to join sensor body 302 with electronics enclosure 338. In still yet another embodiment, one or more attachment means can be utilized to secure, or even further secure, sensor body 302 to electronics enclosure 338. Suitable attachment means include, but are not limited to, screws, rivets, bolts, etc. In another embodiment, electrical enclosure 338 is also designed as an electrical and thermal insulator. In this embodiment, electrical enclosure 338 prevents the beam current captured by MFC 310 from being conducted to the support stand via a clamp ring. Thus, in this embodiment all of the current in MFC 310 is channeled to MFC lead 318 and then onto a suitable computer system via suitable connecting wires. In addition, electrical enclosure 338 provides both a thermal and electrical barrier from the heat and backscatter electrons generated from the beam hitting the beam dump directly below sensor 300.

As can be seen from FIG. 2, the bottom portion of electronics enclosure 338 is fitted to a lower annular-shaped (or cylindrically-shaped) clamp ring body 344 and lower clamp ring 346. In one embodiment, clamp ring body 344 and lower clamp ring 346 are operatively connected and form an integrated bottom portion of sensor 300. In one embodiment, clamp ring body 344 and lower clamp ring 346 are operatively connected to one another via any suitable attachment means. Suitable attachment means include welding, compression fitting, adhesives, etc. In another embodiment, alternatively, or in addition to, the above mentioned attachment means for attaching clamp ring body 344 to lower clamp ring 346 comprises one or more screws (not pictured) that are designed to fit into one or more screw recesses 348 and screw into one or more corresponding threaded inserts 350 located in the bottom surface of electronics enclosure 338.

Regarding the materials from which the various components of beam imaging and/or profiling sensor 300 are formed from, such materials are not critical so long as the materials can withstand the energy levels to which they are exposed. As noted above, the material utilized to form MFC 310 needs to be electrically conductive as does the material utilized to form MFC lead 318. In one embodiment, both MFC 310 and MFC lead 318 are formed from the same material so that the electrical conductivity of these components of beam imaging and/or profiling sensor 300 are identical in nature. Alternatively, in another embodiment, it may be desirable to form MFC 310 and MFC lead 318 from different electrically conductive materials disclosed above.

In another embodiment, sensor body 302 is formed from a metal or metal alloy. Suitable metals, or metal alloys, include but are not limited to, corrosion resistant metals, or metal alloys, such as aluminum, titanium, stainless steel, martensitic stainless steel, duplex and/or super duplex stainless steel; high austenitic alloys, nickel-based alloys, and/or titanium alloys. In one embodiment, inner clamp ring 320 and outer clamp ring 322 are independently formed from any suitable metal, or metal alloy. Suitable metals, or metal alloys, include, but are not limited to, high-energy resistant metals, metal alloys, or combinations thereof. Suitable high-energy resistant metals, or metal alloys, include, but are not limited to, chrome-moly steel, tungsten, molybdenum, hafnium, or suitable alloys thereof. In one embodiment, inner slit disc 324 and outer slit disc 326 are independently formed from any suitable metal, metal alloy, or refractory material. Suitable metals, metal alloys, or refractory materials include, but are not limited to, tungsten, molybdenum, hafnium, or alloys thereof. In one embodiment, electronics enclosure 338 is formed from an electrically non-conductive material. Suitable electrically non-conductive materials include, but are not limited to, one or more organic-based or inorganic-based insulating compounds, glass-epoxy insulators (e.g., G-10), ceramic insulators, or any combination of two or more thereof. Suitable insulating compounds include, but are not limited to, phenolic resin-based insulating compounds, polytetrafluoroethylene-based insulating compounds (i.e., Teflon®-based insulating compounds, polyoxymethylene (a.k.a., acetal, polyacetal and/or polyformaldehyde such as Delrin®), alumina insulating compounds (e.g., high purity alumina or alumina silicate), silicon-based insulating compounds (e.g., silicon nitride), insulating glass compounds (e.g., machineable borosilicate glasses such as Macor®).

In one embodiment, the one or more threaded inserts 350 are each independently formed from a metal or metal alloy. Suitable metals, or metal alloys, include but are not limited to, corrosion resistant metal, or metal alloys, such as aluminum, titanium, stainless steel, martensitic stainless steel, duplex and/or super duplex stainless steel; high austenitic alloys, nickel-based alloys, and/or titanium alloys. In another embodiment, the one or more threaded inserts 350 are formed from the same material so as to facilitate the coupling of same as described above. In one instance the one or more threaded inserts 350 are formed from a suitable grade of stainless steel (e.g., 330 SS, 304 SS, and/or 316 SS). In one embodiment, clamp ring body 344 and lower clamp ring 346 are independently formed from a metal or metal alloy. Suitable metals, or metal alloys, include but are not limited to, corrosion resistant metal, or metal alloys, such as aluminum, titanium, stainless steel, martensitic stainless steel, duplex and/or super duplex stainless steel; high austenitic alloys, nickel-based alloys, and/or titanium alloys. In another embodiment, clamp ring body 344 and lower clamp ring 346 are formed from the same material so as to facilitate the coupling of same as described above. In one instance clamp ring body 344 and lower clamp ring 346 are formed from a suitable grade of stainless steel (e.g., 330 SS, 304 SS, and/or 316 SS).

Given the above, various advantages of the present invention versus that of the sensor of FIG. 1 will be discussed herein. It should be noted that the present invention is not limited to solely the following advantages. Rather, the following advantages are non-limiting in nature.

Slit Width and Profile:

The width and profile (i.e., thru thickness) of slit 332 are important to the operation and repeatability of sensor 300. The width of slit 332 determines how much beam energy is permitted to enter MFC 310 at a given time. The remainder of the beam energy is absorbed by the material from which inner slit disc 324 and outer slit disc 326 are formed from. The amount of energy entering MFC 310 in a given time period must be limited to prevent melting of and/or damage to MFC 310 because it is formed from a relatively low melting point conductive metal, or metal alloy material (e.g., copper, silver, gold, platinum, etc.). The maximum amount of energy that can satisfactorily be detected in MFC 310 is dependent upon the voltage, current level, and the focus position of the electron and/or ion beam.

In general, higher voltage/current beams that are more focused at the surface of sensor 300 require more limitations on the energy permitted to enter MFC 310 in a given time period to prevent damage to, or melting of, MFC 310. In addition to the width of slit 332, the thru thickness profile of slit 332 and/or the perpendicularity of slit 332 can introduce an error in the signal generated by MFC 310 because some of the energy that enters slit 332 is absorbed by the thru thickness surface of slit 332. It is therefore advantageous in one embodiment to have a slit geometry that has a relief angle on the backside of slit 332 to minimize the impingement of the beam on the thru thickness cross-section of slit 332.

By the nature of the design for the device of FIG. 1, the radial slits must be produced using a wire EDM process. Given this, the minimum slit width that can be reliably produced via such a process is 0.006 inches. In addition, if a relief angle is desired on the backside of the slit of the device of FIG. 1 (in order to reduce the amount of signal loss for the MFC of FIG. 1), then the minimum slit width that can readily be produced will increase in proportion to the relief angle.

In contrast, sensor 300 of the present invention utilizes a set of concentrically nesting inner and outer slit discs (324 and 326 respectively) formed from, for example, a refractory material to create the desired slit width. Given this, the slit width of the present invention is determined by the outer diameter of inner slit disc 324 and the inner diameter of outer slit disc 326, and the concentricity between inner slit disc 324 and outer slit disc 326. Using machining methods known to those of skill in the art, the combination of inner slit disc 324 and outer slit disc 326 can obtain slit widths of less than or equal to 0.010 inches, of less than or equal to 0.0075 inches, of less than or equal to 0.005, or even less than or equal to 0.002 inches. Here, as well as elsewhere in the specification and claims, different individual numerical limits can be combined to form non-stated numerical ranges. Such slit widths can be accurately and controllably produced due to the design of the present invention. Additionally, if a relief angle is applied to the backside of slit 332 there is no change in the minimum slit width that can be achieved with the design of the present invention.

Number of Slits:

As can be seen from FIG. 1, the design disclosed therein has multiple slits 216 at different angles that produce various cross sections of beam energy that must be mathematically reconstructed to provide both a two and three dimensional model of the beam. Given this, the more cross-sectional angles there are (i.e., the greater number of slits 216), the more accurate the reconstruction model. Given this, the sensor design of FIG. 1 has significant limitations regarding the number of slits that can be used. The first limitation is the physical stability of disk 201 to maintain the desired slit width when under the high thermal load as a result of profiling a beam. Slits 216 spaced too close together will result in insufficient stiffness for the ligaments between the slits and will result in variations in the slit width as a result of the mechanical forces generated by the transient thermal load to the sensor during profiling.

The second limitation of the sensor of FIG. 1 is based upon the geometry of the beam being profiled. At the point where the beam is being translated across the sensor of FIG. 1 the distance between adjacent slits must be at least equal to the diameter of the beam. Otherwise, the data signal from MFC of the sensor of FIG. 1 will be inaccurate as beam energy is entering the MFC from two adjacent slits at the same time. Since there is a need in the industry to profile both highly focused (i.e., beams having small beam diameters) and defocused beams (i.e., beams having large beam diameters), the sensor of FIG. 1 is, at a minimum, less capable for defocused beam conditions. It is also not practical to increase the diameter of the sensor of FIG. 1 so as to provide more distance between adjacent radial slits for reasons explained below.

In contrast to the sensor of FIG. 1, the sensors of the present invention utilize a single slit 332 whose dimensions are maintained by the robustness of the concentrically nesting inner and outer slit discs (324 and 326, respectively). The approach for probing using a sensor according to the present invention involves translating the beam across and perpendicular to slit 332 from the inner diameter to the outer diameter of the sensor. Data is collected for a given beam position and then indexed to the next desired angle position. With this method, the number of angles for which the beam cross section is analyzed can be as coarse or fine (on the order of a degree) as desired by a user. In addition, due to the nature of the sensor design of the present invention there is no risk of errant data as a result of the beam energy entering multiple slits as is the case with the sensor of FIG. 1.

Beam Deflection Angle:

The sensor of FIG. 1 requires the beam to be translated across slits 216 using a circular beam deflection path as defined by the welding process where the origin of the beam is coincident with the center of the sensor of FIG. 1. The radius for this deflected beam is highly dependent upon the distance from the electron beam gun to the sensor and is limited by the physical and electrical characteristics of the electron gun. Many companies have production welding procedures where the gun is less than six inches from the work surface. Given this, the make and manufacturer of the electron beam gun will determine the maximum deflection distance achievable at these gun-to-work distances, but it is typically on the order of one inch. Thus, the translation method across slits 216 required by the sensor of FIG. 1 results in the beam not being perpendicular to one or more of slits 216 because the deflection angle required to create the circular beam path. This non-perpendicularity of the beam results in an artificial error for the measured beam diameter, shape and power distribution.

On the other hand, a sensor in accordance with the present invention utilizes a single slit whose dimensions are maintained by the robustness of the concentrically nesting inner and outer slit discs (324 and 326, respectively). The approach for probing using a sensor according to the present invention involves translating the beam across and perpendicular to slit 332 from the inner diameter to the outer diameter of the sensor. Data is collected for a given beam position and then indexed to the next desired angle position. The nature of the beam translation for the sensor of the present invention places the beam freefall position (i.e., undeflected) directly over slit 332. This method produces a more accurate measurement of the beam because it is perpendicular to the surface of the slit in both the X and Y planes. Regardless of the method of translation for the beam (the sensor of FIG. 1 or the present invention), the beam is subject to a magnetic field to generate the translation path. The higher the deflection angle and the higher the rate of beam translation will require a higher magnetic field to produce the desired path. It is well known that high magnetic fields can distort the shape of the electron beam. Thus another advantage of the approach of the present invention is that with the beam freefall position positioned directly over the slit the magnitude of the magnetic field for translation of the beam is minimized and is zero when the beam is perpendicular to the slit. This approach provides the most accurate measurement of the beam characteristics.

Sensor Thermal Load:

The sensor of FIG. 1 claims to be capable of measuring high energy beams on the order of 10 s of kilowatts. This capability is far over-stated due to the design and required profiling method using the sensor of FIG. 1. The process of probing with the sensor of FIG. 1 results in all of the beam energy being absorbed through the start/stop block, central hole, and the disk itself. It is well known by those of skill in the art that focused electron beam settings greater than 20 kW can impart a tremendous thermal load (even to the point of vaporization) to the substrate. The air cooled version of the sensor of FIG. 1 has been shown to have a thermal limitation of approximately 5 kW. A water-cooled version of the sensor of FIG. 1 will increase the capabilities of the sensor, but its maximum capacity will be far below the maximum power output of today's electron beam machines.

In contrast, the design of the sensor of the present invention utilizes a hollow inner diameter for the sensor that permits the beam to pass by the sensor and into a separate beam dump device. The act of profiling involves momentarily translating the beam across a circular or polygonal circumferential slit, then returning the beam to the center of the sensor where it is again captured by the beam dump. This approach to profiling imparts a much lower energy and thermal load to the sensor of the present invention. Thus, the sensor of the present invention is capable of profiling beams at much higher power levels than the sensor of FIG. 1. For example, the sensor designs of the present invention can profile beams having power levels in excess of 30 kW. Since there are many production electron beam welding procedures at beam energy levels in excess of 10 kW, the sensor of the present invention permits a user to profile a beam at actual production welding parameters. In contrast, the sensor of FIG. 1 requires a user to extrapolate the results from much lower beam power settings. It is well known by those of skill in the art that extrapolation of the beam characteristics is highly inaccurate.

Faraday Cup Design:

The design of the sensor of FIG. 1 requires the use of a second disk (i.e., conduction disk) that is used to block secondary ions/electrons from leaving the MFC of the sensor of FIG. 1. The conduction disk must have radial slits through thickness and aligned with the radial slits in the refractory disk. By the nature of machining and alignment tolerances the need for two aligned radial slit disks introduces an additional error in the measured signal. Some portion of the beam energy that passes through the first radial slits 216 in the refractory disk may not be aligned with the radial slits 212 in the conducting disk and therefore do not get contained within the MFC.

The sensor design of the present invention utilizes a MFC 310 that eliminates the need for a conducting disk to control secondary ions/electrons. The design of MFC 310 is such that the secondary ions/electrons are reflected into the internal cavity of MFC 310 and therefore remain contained within MFC 310. Thus, the approach and design of the present invention reduces error in the measured signal.

Turning to FIGS. 4 and 5, these Figures illustrate alternative embodiments of the present invention where slit 332 is polygonal in shape. Regarding sensor 400 of FIG. 4 and sensor 500 of FIG. 5, these sensors are identical in design and make-up to sensor 300 described above except with regard to the geometric shape of their respective slits formed from their respective nesting inner and outer slit discs (424/426 and 524/526, respectively). FIG. 4 illustrates a hexagon-shaped slit 402, whereas FIG. 5 illustrates an octagon-shaped slit 502. It should be noted that the advantages discussed above with regard to sensor 300 apply to sensors 400 and 500 as well. In additional to various other polygonal-shaped slits (not just those pictured in FIGS. 4 and 5), the sensors of the present invention can have slits profiles, or geometries, that include flats tangent to the rings and at several different angles around the circumference. Thus, any suitable polygonal-shaped slit path can be so produced. In one embodiment, if such slit flats are aligned with the desired angle for profiling, then the beam would be measured by a slit having a straight line profile. Additionally, as can be seen in both FIGS. 4 and 5, the present invention can in one embodiment possess alignment aids 404 and 504, respectively, which are in part formed on each of inner slit discs 424 and 524 and in part on each of outer slit discs 426 and 526. As can be seen in FIGS. 4 and 5, alignment aids 404 and 504 are illustrated as a two part straight line alignment mark. However, this feature of the present invention is not limited thereto. Rather, any suitable indicia could be utilized to provide an alignment aid to permit a user to more accurately, or properly, align the inner slit disc with the outer slit disc of a beam imaging sensor according to the present invention. For example, the straight line mark 404 and/or 504 could be replaced with a pair of indicia with one indicia from each pair being formed on each of the inner slit disc and the outer slit disc directly across from one another. Suitable indicia include, but are not limited to, any suitable combination of two or more dots, two or more circles, two or more Xs, two or more like or different letters, two or more like or different numbers, two or more arrows, etc.

In still another embodiment, inner and outer slit discs (324 and 326, respectively) can be replaced with arc segments. In still another embodiment, inner and outer slit discs (324 and 326, respectively) can be formed to be non-circular. In still another embodiment, the width of slit 332, 402 and/or 502 can be varied along the slit path by adding lobes to the profile of inner and outer slit discs (324 and 326, respectively) or arc segments. Thus one non-limiting embodiment is where at twelve o'clock the slit width is, for example, 0.002 inches, at three o'clock the slit width is changed as desired and, for example, could be set at 0.006 inches. Additional slit width and profile changes could be made along the remainder of the slit path as desired. In one embodiment, when the width of slit 332 is varied along the slit path, or comprises one or more lobes, the inner slit disc and the outer slit disc of any of the embodiments of the present invention can further possess one or more alignment aids, or sets of alignment aids, similar to those describe above with regard to FIGS. 4 and 5. Again, any suitable indicia could be utilized to provide an alignment aid to permit a user to more accurately, or properly, align an inner slit disc with an outer slit disc of a beam imaging sensor according to the present invention. Suitable indicia include, but are not limited to, any suitable combination of two or more dots, two or more circles, two or more Xs, two or more like or different letters, two or more like or different numbers, two or more arrows, etc.

Turning to FIGS. 6 and 7, FIG. 6 illustrates the path of an electron beam through a sensor according to the present invention. As is illustrated in FIG. 6, three different portions of an electron, or ion, beam are illustrated via arrows 602 a, 602 b and 602 c. As can be seen from FIG. 6, a portion of an electron, or ion, beam upon “hitting” sensor 300 passes on the outside side of sensor 300 (represented by arrow 602 a), whereas another portion passes through the inside cylindrically-shaped portion of sensor 302 (represented by arrow 602 b). A third portion of the electron, or ion, beam “hits” sensor 300 at slit 332 in a substantially perpendicular orientation (represented by arrow 602 c). At least a portion of the beam 602 c that impacts sensor 300 at slit 332 is able to pass through slit 332 and into MFC 310 where this portion of beam that pass through slit 332 is represented by arrow 604 in FIG. 6. Due to the passage of a portion of the electron, or ion, beam 604 through slit 332 into MFC 310 a current is able to be generated due to the beam being reflected around the internal space 610 (see FIG. 7) of MFC 310 in one exemplary pattern represented by arrow 620 (see FIG. 7). Turning to FIG. 7, FIG. 7 is a close-up cross-sectional slice of the upper left hand portion of FIG. 2. Given this, FIG. 7 illustrates one possible beam path 620 in MFC 310 when the portion 604 of the electron and/or ion beam 602 c passes through slit 332. Thus, as can be seen from FIG. 7, the portion of the electron, or ion, beam that passes through slit 332 and into MFC 310 is reflected off the internal surfaces of MFC 310 in one exemplary pattern 620, thereby generating a current and/or signal that is picked-up and/or transmitted by MFC 310 to MFC lead 318 and onto a suitable computer to be analyzed as detailed above.

Turning to FIG. 8, FIG. 8 is a close-up illustration of the MFC portion of a beam imaging sensor illustrating one possible design layout for the MFC portion of a beam imaging sensor according to one embodiment of the present invention. As illustrated in FIG. 8, MFC 310 of the present invention should be designed to minimize, reduce and/or eliminate the number, or amount, of electrons or ions that escape from MFC 310 after entry thereto. In other words, once portion 604 of beam 602 c enters into MFC 310 and begins to undergo reflection therein in, for example, the path represented by arrow 620 (see FIG. 7), the amount of electrons and/or ions that escape from MFC 310 should be reduced to as few as possible, or even eliminated altogether. One manner by which such a goal can be accomplished is by controlling the internal geometry of MFC 310. For example, in one embodiment MFC 310 is designed taking into consideration four geometric factors. The four factors are represented in FIG. 8 by the variables A₁, A₂, A₃ and A₄ in FIG. 8. As can be seen in FIGS. 2, 3, 6, 7 and 8, MFC 310 is formed by two or more pieces 312 and 314 as discussed above and contains therein an internal space 610 (see FIG. 7) that is formed from the combination of one substantially straight internal sidewall, one sloped internal sidewall, a sloped (or canted) bottom, and an open top designed to permit a portion 604 of beam 602 c to enter into space 610 of MFC 310. In one embodiment, space 610 is similar in shape to the side profile of a human nose. Additionally, the sloped internal sidewall of space 610 is, in one embodiment, formed in one integral piece with the sloped bottom of space 610 and together form a rounded corner at the lower end of the sloped bottom of pace 610 (see FIGS. 2, 3, 6, 7 and 8). However, it should be noted that the present invention is not limited to any one profile for space 610 and/or any one manner in which space 610 is formed.

After entry into space 610 of MFC 310, beam portion 604 bounces around, or is reflected, within space 610 in any number of patterns including the exemplary one illustrated by path 620 in FIG. 7. Given this, by selecting various dimensions and/or angles of the three sides of space 610 in MFC 310 one can optimize the amount of electrons, or ions, that are permitted to enter space 610 as well as the amount of electrons, or ions, that are “lost” to backscatter by escaping space 610 of MFC 310.

Given the considerations and factors discussed above, A₁ is in one embodiment set to be slightly larger than the width of slit 332 in order to facilitate capture, or transmission, of substantially all, or completely all, of the electrons, or ions, that pass through slit 332 and are denoted herein as beam portion 604. Thus, given the fact that slit 332 can vary in width, there is no set dimensional range for A₁. In other words, A₁ can be selected to be any width so long as the width of A₁ is greater than the width of slit 332. In one non-limiting embodiment, slit 332 is 0.05 inches in width or less (i.e., about 1.27 mm or less) and A₁ is about 0.1 inches in length (i.e., about 2.54 mm). Again, as is stated above, the dimensions for slit 332 as well as A₁ are not to be construed as limited to any of the exemplary dimensions discussed herein. Turning to dimension A₂, A₂ represents the amount of slope in the one internal sidewall of space 610. In one embodiment, the sloped internal sidewall of space 610 has a positive slope and has an angle, denoted A₂ in FIG. 8, of between about 5 degrees and about 25 degrees. In another embodiment, the angle measured, or denoted by, A₂ is in the range of about 7.5 degrees to about 20 degrees, or from about 10 degrees to about 17.5 degrees, or even about 15 degrees. Here, as well as elsewhere in the specification and claims, different individual numerical limits can be combined to form non-stated numerical ranges.

Turning to dimension A₃, A₃ represents the minimum depth of space 610 as can be seen in FIG. 8. Given this, in one embodiment there is no set dimensional range for A₃. In another embodiment, A₃ is in the range of about 0.1 inches (i.e., about 2.54 mm) to about 0.5 inches (i.e., about 12.7 mm), or from about 0.2 inches (i.e., about 5.08 mm) to about 0.4 inches (i.e., about 10.16 mm), or even about 0.25 inches (i.e., about 6.35 mm). Here, as well as elsewhere in the specification and claims, different individual numerical limits can be combined to form non-stated numerical ranges.

Turning to dimension A₄, A₄ represents the amount of slope in the sloped (or canted) bottom 610. In one embodiment, the slope (or canted) bottom of space 610 has a positive slope and has an angle, denoted A₄ in FIG. 8, of between about 5 degrees and about 35 degrees. In another embodiment, the angle measured, or denoted by, A₄ is in the range of about 7.5 degrees to about 30 degrees, or from about 10 degrees to about 27.5 degrees, or even about 25 degrees. Here, as well as elsewhere in the specification and claims, different individual numerical limits can be combined to form non-stated numerical ranges.

It should be noted that the shape and/or composition of space 610 is not to be limited to just those embodiments discussed above. Rather, space 610 could be formed to have more than three walls so long as the top of space 610 is open to permit entry of at least a portion of an electron, or ion, beam. For example, any one, or both, of the internals sidewalls of space 610 could be sloped or faceted with two or more facets so long as space 610 is designed to retain as many as possible of the electrons, or ions, that enter therein. Given this, space 610 of MFC 310 is not limited to any one geometrical shape, or layout, so long as space 610 is formed to optimize the amount of electrons, or ions, that are permitted to enter space 610 and remain therein without losing, in one embodiment, a significant amount, or even no, electrons, or ions, to backscatter by escaping space 610 of MFC 310.

Turing to FIGS. 9 through 12, these Figures illustrate various alternative embodiments for securing and/or attaching various portions of the beam sensors of the present invention to one another. Specifically, FIG. 9 is a close-up illustration of a side portion of beam sensor 300 that illustrates an alternative manner to attach and/or secure outer clamp ring 322 to sensor body 302. As illustrated in FIGS. 9 and 11, the threaded portions of outer clamp ring 322 and the outer threaded surface of sensor body 302 (see FIGS. 2, 3, 6 and 7) have been eliminated. Instead of utilizing a threaded arrangement to secure outer clamp ring 322 to sensor body 302 a series of two or more, three or more, or even four or more securing arm clamps 570 are designed to operatively engage a securing means (e.g., a tooth 572) that is formed along the circumferential outer surface of outer clamp ring 322. Additionally, each securing arm clamp 570 has a corresponding tooth 574 that is designed to engaged and secure in combination with tooth 572 outer clamp ring 322 to sensor body 302. As can be seen in FIGS. 9 and 11, each securing arm clamp 570 is rotatably attached to sensor body 302 via a suitable attachment means including, but limited to, an eccentric screw, a screw, a rivet, a pin, or any other attachment means 576 that permits clamp 570 to be operatively rotatable (see, e.g., the double-headed arrow 578 in FIG. 9). Regarding the ability of clamp 570 to be rotatably engaged and/or disengaged, this is accomplished by corresponding circumferential notches 580 and 582 that are respectively formed on the outer surface of both sensor body 302 and outer clamp ring 322 (see FIG. 9) that permit the desired number of clamps 570 to be rotatably engaged, or unengaged, by rotating each respective clamp in an arc motion (see, e.g., the double-headed arrow 578 in FIG. 9). Regarding reference numeral 584, this reference refers to an internal opening in sensor body 302 that permits MFC lead 318 to pass through sensor body 302 and eventually make electrical contact with MFC 310 (see FIGS. 2 and 11 as well as additional details above).

Turning to the embodiment of FIG. 10, FIG. 10 illustrates an alternative embodiment to the clamps 570 of FIG. 9. As can be seen from FIG. 10, each one or more clamps 570 from FIG. 9 may be replaced with a clamp 670. As can be seen in FIG. 10, clamp 670 contains therein a wire cut flexure portion 675 to permit clamp 670 to maintain, or possess, spring compliance if so desired and/or needed. Besides this wire cut flexure portion (or feature) 675, the remainder of this embodiment is similar to that the embodiment of FIG. 9. Accordingly, for the sake of brevity a detailed description of the additional features and the workings of clamp 670 is omitted herein.

It should be noted that in still another embodiment of the present invention any desired numerical combination of one or more of clamp 570 can be combined with one or more of clamp 670 to secure outer clamp ring 322 to sensor body 302. Given this, the present invention encompasses: (i) utilizing a series of two or more, three or more, or even four or more securing arm clamps 570; (ii) utilizing a series of two or more, three or more, or even four or more securing arm clamps 670; and/or (iii) utilizing any desired combination of two or more, three or more, or even four or more securing arm clamps 570 and 670 to secure outer clamp ring 322 to sensor body 302.

Turning to FIG. 12, FIG. 12 illustrates an alternative embodiment for securing inner clamp ring 320 to sensor body 302. As is illustrated in FIGS. 2, 3, 6 and 7, inner clamp ring 320 is secured to sensor body 302 via threaded portions that are formed on the corresponding inner circumferential surface at the top end of sensor body 302 and the outer circumferential surface of inner clamp ring 320. In the embodiment illustrated in FIG. 12, inner clamp ring 320 is secured to the inner circumferential portion of sensor body 302 via two or more, three or more, or even four or more clamp arms 790. As can be seen from FIG. 12, clamp arm 790 is secured to the inner surface of sensor body 302 via any suitable attachment means including, but limited to, an eccentric screw, a screw a rivet, a pin, or any other attachment means 792 that permits clamp arm 790 to be operatively secure inner clamp ring 320 to sensor body 302. Regarding how attachment means 792 is securely tightened; one such manner is illustrated in FIG. 12 where a thru hole, or opening, 794 is formed from the external circumferential surface of sensor body 302 thru the complete width of sensor body 302 to permit the corresponding insertion and external tightening of attachment means 792. In one embodiment, the use of an eccentric screw for attachment means 792 makes this thru hole, or opening, 794 embodiment for securing clamp arm 790 particularly useful. Alternatively, attachment means 792 could be securely tightened via a suitable designed tool that would permit one to tighten the attachment means 792 from the inside surface of sensor body 302.

Regarding the manner in which clamp arm 790 engages the desired lower portion of inner clamp ring 320, in one embodiment a suitably sized dowel pin 796 can be formed in, or secured to, two or more, or three or more, or even four or more places on the lower inner lip portion of inner clamp ring 320. In this embodiment, a corresponding opening, or hole, 798 is formed at the top end of clamp arm 790 to permit at least a portion of dowel pin 796 to pass there through. Given the above and as can be seen from FIG. 12, a lower portion of clamp arm 790 resides in notch 800 formed in the inner circumferential surface of sensor body 302, while a top portion of clamp arm 790 resides in notch 802 formed in the inner circumferential surface of inner clamp ring 320.

As would be apparent to those of skill in the art upon reading and understanding the disclosure of the present invention, clamp arm 790 is first secured to inner clamp ring 320 via dowel pin 796 (or some other suitable equivalence thereof). Next, attachment means 792, which in this embodiment is an eccentric screw, is then utilized to secure clamp arm 790 to sensor body 302 via thru hole 794 so as to substantially, or even totally, restrict the movement of clamp arm 790. In light of the use of two or more, or three or more, or even four or more clamp arms 790, inner clamp ring 320 can be securely mounted to, or fastened to, sensor body 302. Regarding the attachment of outer clamp ring 322 to sensor body 302, in one embodiment this is accomplished by rotatably securing clamps 570 to each clamp's respective tooth 572 and then further tightening attachment means 576 so as to secure outer clamp ring 322 to sensor body 302.

In another embodiment of the present invention, the beam imaging sensor disclosed herein could be formed so as to have any desired shape. Such shapes include not only the substantially circular shape of FIGS. 2 through 12, but elliptical, polygonal, arced, etc. In the case where the beam imaging sensor of the present invention has a shape other than circular, at least sensor body 302 is formed to have, for example, a polygonal shape and/or an elliptical shape. In this case the sensor of FIG. 3 may be elliptical, or polygonal in shape rather than the circular shape shown therein.

Turning to FIG. 13, FIG. 13 is a partial top-down illustration of the top portion of a beam imaging sensor 300 a according to still another embodiment of the present invention. In the embodiment of FIG. 13 nesting inner slit disc 324 and outer slit disc 326 have been replaced with nesting inner slit disc 324 a and outer slit disc 326 a. Discs 324 a and 326 a differ from discs 324 and 326 in that discs 324 a and 326 a have alignment protrusions formed thereon. Specifically, outer slit disc 326 a has a protrusion 904 formed thereon which fits into a corresponding notch, or indentation, 906 formed in outer ledge 330 a of sensor body 302 a such that outer slit disc 326 a can only be seated into outer ledge 330 a in one orientation. Although outer slit disc 326 a and outer ledge 330 a are shown with only one protrusion/notch combination, any number of protrusion/notch combinations can be utilized on outer slit disc 326 a and outer ledge 330 a so long as there is only one orientation in which to seat outer slit disc 326 a into outer ledge 330 a of sensor body 302 a. Regarding inner slit disc 324 a, inner slit disc 324 a has a protrusion 908 formed thereon which fits into a corresponding notch, or indentation, 910 formed in inner ledge 328 a of sensor body 302 a such that inner slit disc 324 a can only be seated into inner ledge 328 a in one orientation. Although inner slit disc 324 a and inner ledge 328 a are shown with only one protrusion/notch combination, any number of protrusion/notch combinations can be utilized on inner slit disc 324 a and inner ledge 328 a so long as there is only one orientation in which to seat inner slit disc 324 a into inner ledge 328 a of sensor body 302 a. It should be noted that the remainder of beam imaging sensor 300 a, although not illustrated, is identical in nature to beam imaging sensor 300 as described above.

Turning to FIG. 14, FIG. 14 is a partial top-down illustration of the top portion of a beam imaging sensor 300 b according to still another embodiment of the present invention. In the embodiment of FIG. 14 nesting inner slit disc 324 and outer slit disc 326 have been replaced with nesting inner slit disc 324 b and outer slit disc 326 b. Discs 324 b and 326 b differ from discs 324 and 326 in that discs 324 b and 326 b have alignment notches, or indentations, formed therein. Specifically, outer slit disc 326 b has a notch, or indentation, 914 formed therein which receives a corresponding protrusion 912 formed on outer ledge 330 b of sensor body 302 b such that outer slit disc 326 b can only be seated into outer ledge 330 b in one orientation. Although outer slit disc 326 b and outer ledge 330 b are shown with only one protrusion/notch combination, any number of protrusion/notch combinations can be utilized on outer slit disc 326 b and outer ledge 330 b so long as there is only one orientation in which to seat outer slit disc 326 b into outer ledge 330 b of sensor body 302 b. Regarding inner slit disc 324 b, inner slit disc 324 b has a notch, or indentation, 918 formed therein which receives a corresponding protrusion 916 formed on inner ledge 328 b of sensor body 302 b such that inner slit disc 324 b can only be seated into inner ledge 328 b in one orientation. Although inner slit disc 324 b and inner ledge 328 b are shown with only one protrusion/notch combination, any number of protrusion/notch combinations can be utilized on inner slit disc 324 b and inner ledge 328 b so long as there is only one orientation in which to seat inner slit disc 324 b into inner ledge 328 b of sensor body 302 b. It should be noted that the remainder of beam imaging sensor 300 b, although not illustrated, is identical in nature to beam imaging sensor 300 as described above.

In still yet another embodiment, a beam imaging sensor according to the present invention can utilize a set of nesting slit discs where one of the nesting slit discs has a protrusion formed thereon so as to fit into a corresponding sized notch, or indentation, in a corresponding ledge of the sensor body while the remaining member of the set of nesting slit discs could have a notch, or indentation, formed therein so as to receive a corresponding sized protrusion in a corresponding ledge of the sensor body. Thus, this embodiment is a combination of FIGS. 13 and 14 where one slit disc of the set of nesting slit discs is designed as illustrated in FIG. 13 and the other slit disc of the set of nesting slit discs is designed as illustrated in FIG. 14. In still another embodiment, the position of the protrusion/notch combinations of FIGS. 13 and 14 along the circumferential edges of the slit discs and/or sensor body ledges is not critical so long each of the nesting slit discs of these embodiments can only be positioned in one orientation the beam sensor of the present invention. That is, although FIGS. 13 and 14 illustrate the respective protrusion/notch combinations at roughly one o'clock and seven o'clock, such any one or more combinations of protrusions/notches could be moved in any amount clockwise or counter-clockwise along the various circumferential edges described above. Given the above, the various protrusion/notch combinations of the embodiments of FIGS. 13 and 14 permit the nesting slit discs of the present invention to be more accurately oriented with respect to not only one another but with respect to the overall design of the beam imaging sensor of the present invention.

In still another embodiment, any one or more of the protrusion/notch combinations described above could be replaced by a pin/hole combination, where the pin would be a protrusion formed along the circumferential outer edge of an outer slit disc of the present invention and would fit into a corresponding hole formed in the outer ledge of the sensor body of the beam imaging sensor. Regarding the inner slit disc in this embodiment, the inner slit disc would have a pin formed along the circumferential inner edge of an inner slit disc of the present invention and would fit into a corresponding hole formed in the inner ledge of the sensor body of the beam imaging sensor. This pin/hole arrangement also permits the nesting slit discs of the present invention to be more accurately oriented with respect to not only one another but with respect to the overall design of the beam imaging sensor of the present invention. In still yet another embodiment, the pin could be formed in the inner ledge and/or outer ledge of the channel of the sensor body and a corresponding hole formed in the respective slit disc. As would be appreciated upon reading and understanding the embodiments of this paragraph as well as those of FIGS. 13 and 14, such embodiments are not limited to solely a circular, or cylindrically-shaped, sensor body, or even a circular slit 332. Rather, the embodiments of this paragraph, as well as those of FIGS. 13 and 14, can be applied to any of the beam imaging sensor embodiments of described herein. Additionally, although the various protrusions of the embodiments of FIGS. 13 and 14 are shown as semi-circular protrusions any suitable shape can be utilized in these embodiments. That is, the protrusions of the embodiments of FIGS. 13 and 14 can be any desired geometrical shape not just the semi-circular shape illustrated in FIGS. 13 and 14.

Turning to FIGS. 15 through 17, FIGS. 15 through 17 are more detailed illustration of the nesting slit discs of the present invention when it is, as discussed above, desired to have various arc segments, or lobes, formed on the inner and outer slit discs (324 and 326, respectively) so as to enable one to produce a slit 332 a that has to ability to have a variety of slit widths over a given set of segments of the complete slit path. As can be seen from FIGS. 15 through 17, a set of inner and outer slit discs 324 c and 326 c, respectively, along with a fixed pin and/or key protrusion 950 and clocking locations 952 (which are labeled A, B and C relative to both the inner slit disc 324 c and the outer slit disc 326 c) are illustrated. As can be seen in FIG. 15, when the inner and outer slit discs 324 c and 326 c, respectively, are aligned or clocked such that the As, Bs and Cs of each disc align with the same letter on the other disc, the width of slit 332 c along its entire length is constant even though the radius of the various arc segments vary as noted by the R numbers of FIG. 15. Turning to FIG. 16, when with outer slit disc 326 c is rotated 120 degrees counterclockwise, the width of slit 332 d that is formed by the nesting slit discs 324 c and 326 c changes in the three 120 degree arc segments. As can be seen from FIG. 16, the width of the gap (or slit) between A-C (the labels refer to the letters of outer slit disc 326 c) changes from 0.5 inches to 0.7 inches, while the two remaining slit widths between A-B and B-C (the labels refer to the letters of outer slit disc 326 c) change from 0.5 inches to 0.4 inches. Regarding fixed pin and/or key protrusion 950, this feature of the embodiment of FIGS. 15 through 17 permits locking of slit discs 324 c and 326 c in the various positions discussed above such that the a 332 c, 332 d and/or 332 e having the ability to have a fixed or variable slit width along the totality of the slit 332 c, 332 d, and/or 332 e can be achieved.

Turning to FIG. 17, when with outer slit disc 326 c is rotated 240 degrees counterclockwise, the width of slit 332 e that is formed by the nesting slit discs 324 c and 326 c changes in the three 120 degree arc segments. As can be seen from FIG. 17, the slit width of segment A-C changes from 0.5 inches to 0.6 inches, while the slit width of segment AB changes from 0.5 inches to 0.3 inches, and the slit width of segment B-C changes from 0.5 inches to 0.6 inches (the labels refer to the letters of outer slit disc 326 c). Again, fixed pin and/or key protrusion 950 permits locking of slit discs 324 c and 326 c in the various positions discussed above such that 332 e having the widths discussed above can be achieved.

Regarding the embodiments of FIGS. 15 through 17 of the present invention, it should be noted that these embodiments are not limited to the dimensions illustrated therein. Nor are these embodiments limited to three arc segments. Instead, any number of arc segments numbering two or more can be realized. Additionally, the arc segments do not necessarily have to be of equal length (that is a number that is a whole number factor of 360). In still another instance, the embodiments of FIGS. 15 through 17 could be applied to a slit having a geometrical shape other than the circular shape illustrated in FIGS. 15 through 17.

Turning to FIGS. 18 and 19, FIGS. 18 and 19 disclose a beam imaging sensor 1000 according to another embodiment of the present invention. Beam imaging sensor 1000 of this embodiment differs from beam imaging sensor 300 in that sensor 1000 has a partial discontinuous, or partial broken, slit 1032 rather than the complete circumferential slit 332 of sensor 300. Slit 1032 of sensor 1000 is formed from a combination of a separate inner slit plate 1024 and a separate outer slit plate 1026. As can be seen from FIGS. 18 and 19, each portion of the discontinuous, or partial broken, slit 1032 is formed from a pair of separate inner and outer slit plates 1024 and 1026. In the embodiment of FIGS. 18 and 19, four such partial slits 1032 are formed from four pairs of inner and outer slit plates 1024 and 1026. As would be apparent to those of skill in the art this embodiment of the present invention is not limited to just four pairs of inner and outer slit plates 1024 and 1026. Rather, any suitable number of inner and outer slit plate pairs can be utilized to form any number of partial discontinuous, or partial broken, slits 1032 having any suitable length arc between about 90 degrees and about 315 degrees. In still another embodiment, partial discontinuous, or partial broken, slit 1032 can be formed around the full circumferential arc (i.e., 360 degrees) of sensor 1000 rather than just a portion of the arc as illustrated in FIGS. 18 and 19.

As is further illustrated in FIGS. 18 and 19, sensor 1000 further includes anchors plates 1802. Anchor plates 1802 are designed to secure one end of inner and outer slit plates 1024 and 1026 to the top surface of sensor body 1302. Sensor body 1302 differs from sensor body 302 in that notches and/or ledges 328 and 330 (or even in another embodiment channels) formed in the top edge surface of sensor body 302 are not present in sensor body 1302. Instead, sensor body 1302 is formed with a flat top inner surface 1804 and a flat top outer surface 1806 that are slightly raised, by the same amount, above the top surface level of MFC 310 (or, as described above in some embodiments, the pieces that form MFC 310). In light of this arrangement, each set of inner and outer slit plate pairs 1024 and 1026 sits level with respect to one another and are then anchored at each end with one end of an anchor plate 1802. As illustrated in FIGS. 18 and 19, each anchor plate 1802 anchors the opposite ends of two adjacent pairs of inner and outer slit plates 1024 and 1026. Thus, in the embodiment of FIGS. 18 and 19 there are five anchor plates 1802 as there are four sets of inner and outer slit plates 1024 and 1026. Again, as would be apparent to those of skill in the art, the number of anchor plates can vary in accordance with the number of anchor plates 1802 being at least one whole number higher than the number of pairs of inner and outer slit plates 1024 and 1026.

As can be seen in FIGS. 18 and 19, the remaining portion of the top surface of sensor body 1302 is covered with a semi-circular plate 1808 (only half of which is shown in FIG. 18). As would be apparent to those of skill in the art, should the arc length of partial discontinuous, or partial broken, slit 1032 be formed to have an arc length greater than 180 degrees then semi-circular plate 1808 is formed to have a complimentary arc length that when added to the arc length of partial discontinuous, or partial broken, slit 1032 comes to a total arc length of about 360 degrees. As would be apparent to those of skill in the art, the total arc length of slit 1032 and semi-circular plate 1808 do not need to add up to exactly 360 degrees as there could be slight gaps between the two respective edges of the “first” and “last” pairs of inner and outer slit plates 1024 and 1026 and the edges of semi-circular plate 1808. Conversely, should the arc length of partial discontinuous, or partial broken, slit 1032 be formed to have an arc length less than 180 degrees then semi-circular plate 1808 is formed to have a complimentary arc length that when added to the arc length of partial discontinuous, or partial broken, slit 1032 comes to a total arc length of about 360 degrees. Again, as would be apparent to those of skill in the art, the total arc length of slit 1032 and semi-circular plate 1808 do not need to add up to exactly 360 degrees as there could be slight gaps between the two respective edges of the “first” and “last” pairs of inner and outer slit plates 1024 and 1026 and the edges of semi-circular plate 1808.

Turning to FIG. 19, FIG. 19 illustrates a top down view of sensor 1000 and enables one to see that each side of each anchor plate 1802 (except for the one edge of each of the “first” anchor plate and the “last” anchor plate) are secured to each respective inner and outer slit plate 1024 and 1026 via outer attachment openings 1810 designed to receive suitable outer attachment means (not pictured). Suitable outer attachment means for outer attachment openings 1810 include, but are not limited to, screws, bolts, rivets, as well as any equivalent thereof, and are used to secure each individual anchor plate 1802 to the appropriate number of inner and outer slit plates 1024 and 1026 and, if desired sensor body 1302, and via outer attachment openings 1810 formed in each of anchor plates 1802. Regarding the one edge of each of the “first” anchor plate (the bottom edge of leftmost anchor plate 1802 of FIG. 19) and the one edge of the “last” anchor plate (the bottom edge of rightmost anchor plate 1802 of FIG. 19), outer attachment openings 1810 are used to secure these edges of “first” and “last” anchor plates 1802 to the opposite ends of semi-circular plate 1808. Anchor plates 1802 further include inner attachment openings 1812 that are formed along the approximate center line of anchor plates 1802 and are designed to receive suitable inner attachment means (not pictured). Suitable inner attachment means for inner attachment openings 1812 include, but are not limited to, screws, bolts, rivets, as well as any equivalent thereof, and are used to secure each anchor plate 1802 to sensor body 1302 through the gaps located between each adjacent pair of inner and outer slit plates 1024 and 1026 (or for the “first” and “last” anchor plates described above through the gaps located between the outer edges of the “first” and “last” sets of inner and outer slit plates 1024 and 1026 and the edges of semi-circular plate 1808). As would be apparent to those of skill in the art, although FIGS. 18 and 19 illustrate anchor plates 1802 having a total of six attachment openings, the present embodiment is not limited thereto. Rather, any number of attachment openings can be formed in anchor plates 1802 so long as anchor plates 1802 accomplish the goal of securing the positioning of inner and outer slit plates 1024 and 1026 relative to one another, to other sets of inner and outer slit plates 1024 and 1026, and the top of sensor body 1302 while simultaneously permitting the center portion of each of anchor plates 1802 to be secured to the top surface of sensor body 1302 thereby permitting the totality all of the pairs of inner and outer slit plates 1024 and 1026 as well as the desired number of anchor plates 1802 to be securely fastened and positionally fixed to the top surface of sensor body 1302.

Turning now to FIGS. 20A through 25 a method of utilizing any of the beam sensors of the present invention will be described. It should be noted that although FIGS. 20A through 20D only illustrate a partial slit through which the beam to be measured, profiled, or otherwise subjected to at least one form of data acquisition, the method described with reference to FIGS. 20A through 25 is not limited thereto and is equally applicable to any of the sensor embodiments disclosed herein.

Turning to FIGS. 20A through 20D, these Figures illustrate a slit opening 332 and/or 1032 and a representative beam cross-section 1814. In the case of FIGS. 20A through 20D, the arrows contained in these Figures represent the motion of the beam cross-sectional “spot” across slit 332/1032. Initially, the beam is swept from the center of a beam imaging sensor according to any of the embodiments of the present invention radially outward to slightly beyond the outer edge of the cylindrically-shaped beam sensor. Next, the beam is then swept back to the center of the cylindrically-shaped beam sensor. As would be apparent to those of skill in the art the above process could be reversed with the first sweep of the beam proceeding from slightly beyond the outer edge of the cylindrically-shaped beam sensor to the interior center and the second sweep proceeding from the beam sensor center to slightly beyond the outer edge of the cylindrically-shaped beam sensor. The motion of the beam in FIGS. 20B through 20D is represented by arrows 1816. In the instance where the beam sensor of the present invention is formed in accordance with the embodiment of FIGS. 18 and 19, the sweeping of the beam can transit over two or more portions of the discontinuous, or partial broken, slit 1032.

Turning to FIGS. 21 and 22, FIGS. 21 and 22 are illustrations of an electron beam welding (EBW) device and process that can be used in conjunction with the beam sensors of the present invention. As illustrated therein, electron gun 1818 having a focus coil 1820, a deflection coil 1822 and a deflection control system 1823 produces a beam 1824 of electrons which are accelerated in an essentially straight line path from gun 1818 to a workpiece or ground 1826. To make the beam useful for welding it is focused to a small diameter spot (i.e. the cross-over) 1828 to increase the power density for welding. If the beam traverses past the crossover it will diverge. For welding, several key factors for the process include (see FIG. 22), but are not limited to, (i) beam current and voltage values; (ii) gun-to-work distance “D;” (iii) the position of the crossover point relative to the surface of the material (note: the crossover point can be above, below, or even at the surface of the workpiece); (iv) the crossover spot size, spot profile, and energy distribution within the spot.

From a beam profiler perspective, one wants to know one or more of the following: (a) the gun-to-work distance (“D”); (b) what focus coil current (focus coil is located inside the electron gun) produces a sharp focus; (c) what is the cross sectional shape of the beam; and/or (d) what is the energy distribution in the beam. Looking now at the differences between previously utilized beam profiles such as the profiler disclosed in United States Patent Application Publication No. 2011/0121180 and the profilers of the present invention, the prior art profiler of United States Patent Application Publication No. 2011/0121180 is shown in FIG. 3 thereof and as stated therein the beam is stated to be coaxial with the profiler disclosed in this prior art publication. As disclosed therein, the beam is deflected so that it can be measured by the Faraday Cup contained in the beam profiler of United States Patent Application Publication No. 2011/0121180. The gun-to-work distance “D” is represented by reference numeral 44 in FIG. 3 of United States Patent Application Publication No. 2011/0121180. Thus, given the disclosure contained in of United States Patent Application Publication No. 2011/0121180, one of skill in the art could, upon reading and understanding the disclosure of this piece of prior art, make the following observations can be made: (i) the effective gun-to-work distance measured by the profiler of United States Patent Application Publication No. 2011/0121180 is represented by reference numeral 16 in FIG. 3 thereof, or is equal to “D” (reference numeral 44 of FIG. 3) times the cosine inverse of the deflection angle. Therefore, one of skill in the art would realize that it is difficult to ascertain and/or control the actual gun-to-work distance being profiled because such distance is not a direct measurement but rather is dependent upon the concentricity of the beam to the profiler and the angle it is swept to enter slit 14; (ii) as can be seen from FIG. 3 slit 14 for the measuring the beam is not perpendicular to the beam axis and as such the true beam diameter is not measured. Thus, since slit 14 is canted relative to the beam axis an error is introduced into the measurement of beam diameter with such error increasing as the sweep angle increases; (iii) for different distances of the gun to the workpiece, as represented by reference numeral 44, one would be required to change the rings to provide a slit angle which matches the new “D” dimension; and (iv) the beam is being measured at a deflected position which increases the distortion of the true beam shape.

In comparison to the profiler described in United States Patent Application Publication No. 2011/0121180, the profilers of the present invention differ in that the combination of the Faraday cup and the various structure slit forming structures (e.g., the inner and outer slit discs or the inner and outer slit plates) form a beam path from the outside of the beam imaging sensor of the present invention to the Faraday cup that is parallel, but not coaxial, with the central axis of the cylindrically-shaped sensor body such that at least a portion of an electron, or ion, beam must be parallel to the central axis of the cylindrically-shaped sensor body of the various beam sensor embodiments of the present invention in order to enter the beam path. Thus, as is illustrated in FIG. 6, as well as FIG. 23, a portion of the beam is deflected from a center area to both the inner and outer sides of sensor body 302/1302 (see beam portions 602 a and 602 b as illustrated in FIGS. 6 and 23). The arrangement at least one or more of the following non-limiting advantages: (a) the actual gun-to-work distance (distance “D”) is used for taking measurements thereby making distance D directly transferable to the actual production welding conditions; (b) the true beam diameter is measured because the beam is coincident with the slit; and/or (c) the beam is measured when the magnetic field deflecting the beam is at its lowest value (602 c), thereby minimizing the distortion of the true beam shape.

The next point of difference between the beam sensors (or profilers) and those of the prior art is the design of MFC 310. The purpose of MFC 310 is to capture the energy of the beam and then in combination with various electronic convert such energy into a voltage signal which can be monitored and recorded by a data acquisition system. Thus, in one embodiment, the objective of the MFC 310 of the present invention is to capture all of the energy of the beam and convert such energy into a voltage signal. Any energy that is lost from MFC 310 results in the added error in the measured signal. The specific geometry of MFC 310 is engineered to prevent the loss of electrons or ions from backscatter (or reflection) as shown in FIGS. 7 and 8.

The profiling approach described in, for example, United States Patent Application Publication No. 2011/0121180 where the undeflected beam is coaxial with the sensor has limited use and is not practical for a majority of commercial applications. The maximum distance the beam can be deflected is a function of the internals of the electron gun and the gun-to-work distance. In one instance, the maximum deflection angle is about 7 degrees. Increasing the deflection angle significantly increases the risk of the deflected beam hitting the internal features of the gun before it exits from the bottom hole. In addition, there are a vast number of commercial electron beam welding applications which use gun-to-work distances on the order of six inches. Therefore, the maximum deflection distance that can be obtained at this gun-to-work distance is on the order of about 0.75 inches (see FIG. 23).

Therefore, if one is trying to profile the beam under production conditions at a six inch gun-to-work distance using the profiler of United States Patent Application Publication No. 2011/0121180 United States Patent Application Publication No. 2011/0121180, the radius of the sensor body (see FIG. 3) must be on the order of 0.75 inches and the overall sensor diameter would be about 1.5 inches. For the various components illustrated in FIG. 3 of United States Patent Application Publication No. 2011/0121180 it would be extremely difficult to produce a sensor of this size. In addition, if such a sensor could be built it would have little value for measuring a beam. The point of the sensors of the present invention, as well as those of the prior art, is to provide the capability to measure high-powered beams. This requires such sensors to be designed and built such that the individual components and the overall sensor have a relatively high thermal load capability. To accomplish this, the individual components need to have some size and thickness to prevent them from being damaged by impinging high-powered beams.

In contrast to the prior art sensors described above, sensors according to the present invention utilize the full deflection width (plus and minus) of the beam (see FIG. 6). The distance between the inner and outer radii of a sensor according to one embodiment of the present invention is such that it is less than two times 0.75 inches (i.e., 1.5 inches). Therefore, a sensor in accordance with the present invention is directly applicable to profiling commercial welding conditions at a six inch gun-to-work distance and the overall size of the profiler can be selected to provide the proper thermal load (or heat sink) needed. One main design constraint is to keep the difference between the inner and outer radii of a beam sensor, or profiler, to less than 1.5 inches. Thus, a sensor in accordance with the present invention could have an outer diameter of about twelve inches with, for example, a nine inch inner diameter. Alternatively, another non-limiting set of dimensions for a sensor according to the present invention is a sensor that has an outer diameter of five inches with an inner diameter of two inches.

The advantages attributable the profiler of the present invention over those of the prior art as exemplified in United States Patent Application Publication No. 2011/0121180 is more evident as the gun-to-work distance decreases. Because of the deflection scheme utilized in United States Patent Application Publication No. 2011/0121180, as the gun-to-work distance decreases, the profiler of United States Patent Application Publication No. 2011/0121180 must get smaller to fit within the deflection distance. As the sensor/profiler of United States Patent Application Publication No. 2011/0121180 gets smaller so does the radius of the slit. When considering the case above for a six inch gun-to-work distance, the slit would have a significant curve, or arc, relative to the manner in which the beam spot travels relative to the slit and sensor disclosed in United States Patent Application Publication No. 2011/0121180. The beam energy is measured by integrating the energy collected in the slit per unit time as the beam passes across the slit. By collecting scans at different angles (as described in United States Patent Application Publication No. 2011/0121180), then a beam reconstruction technique can be used to define a 2-D beam energy profile. Having the slit effectively being an arc segment rather than a straight line, as a result of the manner in which the beam is “swept” across the sensor/profiler, will add error to the beam energy measurement. The beam spot would be calculated to be higher in energy in the central region and lower along the periphery than the true energy distribution. In contrast, the diameter of the slit in the various sensor/profiler embodiments of the present invention are designed such that a slit is large enough that the slit appears as a straight line to the beam spot given the manner in which the beam is “swept” across the sensor/profiler, regardless of gun-to-work distance. This in turn reduces calculation errors in beam energy along the entirety of the sensor/profiler slit across which the beam is “swept” for measurement.

In one embodiment, the method of using the sensors/profilers of the present invention involves a step of deflecting the beam over the sensor/profiler as part of the act of profiling the beam. Deflection systems may be analog or digital and are used to alter the magnetic field around the beam to direct it along a straight path or some other path profile. United States Patent Application Publication No. 2011/0121180 states that the deflection for probing is accomplished using the deflection system of the electron beam machine. For the sensors/profilers of the present invention a separate high-speed digital deflection control system is used to provide the beam movement. A software application is used to program the deflection control system 1823 in combination deflection coil 1822 to provide the desired deflection path shape which in one case is a rectangle. A separate deflection control system 1823 is required for at least two reasons: (i) the deflection control system 1823 in combination with the deflection oil 1822 is energized before the electron beam is turned “ON,” thereby deflecting the beam through the center bore (represented in the embodiments of the present invention by, for example, the cylindrically-shaped opening of sensors 300 and/or 1000 having an inner diameter 304—see FIGS. 2 and 18) of the sensor until the act of beam profiling is initiated. This is extremely important because the beam freefall position (undeflected) is directly over the sensor slit. If the beam is energized before the combination of deflection control system 1823 and deflection coil 1822 is turned on, the beam would strike the sensor and most likely damage its components (dependent upon the power level and time the beam is on). In addition, passing the beam through the center bore of the sensor until it is deflected across the slit (i.e., 332/1032) significantly reduces the heat load and potential damage to the sensor from the beam. As part of the data analysis to determine the beam shape/diameter one must know the velocity of the beam as it moves across the sensor and the velocity must be constant for the entire time period that the beam is interacting with the sensor. Thus, a digital deflection control system permits one to program (via a software application) the desired beam velocity during the deflection pattern; and (ii) the use of a programmable digital deflection control system permits one to define a deflection pattern consisting of a spot attached to a rectangle (see FIG. 24). The beam sits at the spot location for the vast majority of the time. The spot is positioned such that the beam passes through the central bore of the sensor (represented in the embodiments of the present invention by, for example, the cylindrically-shaped opening of sensors 300 and/or 1000 having an inner diameter 304—see FIGS. 2 and 18) so as to not impinge on the sensor and pass through to the beam dump (not shown). The beam is then quickly deflected around the rectangle pattern illustrated in FIG. 24 so as to expose the beam to the sensor/profiler slit, first as an outbound trajectory and then as an inbound trajectory. The outbound and inbound paths are purposely separated so that the beam does not impinge the same spot, or spots, on inner and outer slit discs 324 and 326, or inner and out slit plates 1024 and 1026, which form beam slit 332/1032 in order to minimize the potential for thermal damage (i.e., melting). This approach permits the repeat frequency of the pattern to be both low and programmable while having a very high translation speed for the rectangle pattern. This prevents overheating of a sensor formed in accordance with the present invention when utilized in conjunction with the above stated method.

It is important to note that newer electron beam machines built today utilize digital deflection systems where the beam moves from point to point along a programmed path. However, the digital deflection systems on such devices are inadequate because they fail to produce the desired beam velocity (it is on the order of 5 to 10 times too slow). In addition, the beam velocity is not uniform as a result of the excessive computer computational time required at each of the digital deflection points. A digital deflection system moves the beam through a series of points to get from Point A to Point B (see FIG. 25). Points are added to increase the time (or reduce the velocity) of the beam traversing between Point A and Point B, or points can be removed for the opposite effect. The digital controller moves the beam from one point to another in a series fashion. Once the next point has been reached, the digital controller calculates the path and position for the next point. The velocity between points is at the maximum obtainable speed of the system. Thus, the actual movement from Point A to Point B is a combination of high-speed movements between sub-points and a pause time at each point to calculate the position for the next point. The average of the high speed movements and pause time equals the desired user set velocity. The type of digital deflection system control described above is not desirable for a beam profiling system because the velocity of the beam deflection is not consistent. If a sub-point (or points) were to fall on the slit of the sensor, the beam would stop momentarily in this position and the sensor would read artificially high beam energy. It is for this reason that the sensor/profiler system of the present invention uses a standalone high-speed computational time deflection control system to virtually eliminate the pause (or calculation) time at each sub-point, where the calculation time is on the order of about 20 nanoseconds or less, about 15 nanoseconds or less, about 10 nanoseconds or less, or even about 5 nanoseconds or less. Eliminating the pause time provides a uniform beam velocity. Here, as well as elsewhere in the specification and claims, individual range values can be combined to form additional and/or non-disclosed ranges.

While specific embodiments of the present invention have been shown and described in detail to illustrate the application and principles of the invention, it will be understood that it is not intended that the present invention be limited thereto and that the invention may be embodied otherwise without departing from such principles. In some embodiments of the invention, certain features of the invention may sometimes be used to advantage without a corresponding use of the other features. Accordingly, all such changes and embodiments properly fall within the scope of the following claims. 

What is claimed is:
 1. A beam imaging sensor comprising: a cylindrically-shaped sensor body, wherein the sensor body has a top end and a bottom end, the top end having at least one channel formed therein; a Faraday cup located within the at least one channel, the Faraday cup being positioned to receive at least a portion of an electron, or ion, beam; a plurality of sets inner and outer slit plates positioned at the top end of the cylindrically-shaped sensor body so as to be positioned above the Faraday cup, wherein each set of the plurality of sets inner and outer slit plates are positioned to form a slit there between and where the slit so formed permits the passage of at least a portion of an electron, or ion, beam to the Faraday cup located there below; and at least one conductive lead in electrical communication with the Faraday cup, the at least one conductive lead being able to conduct an electrical signal generated by the portion of the beam that comes into contact with the Faraday cup, wherein the plurality of sets of inner and outer slit plates form a slit that is at least a discontinuous partially circumferential slit.
 2. The beam imaging sensor of claim 1, wherein the beam imaging sensor further comprises: a cylindrically-shaped electronics enclosure, wherein the electronics enclosure has a top end and a bottom end, the top end of the electronics enclosure being coupled to the bottom end of the sensor body.
 3. The beam imaging sensor of claim 2, wherein the beam imaging sensor further comprises: a cylindrically-shaped clamp ring body and a cylindrically-shaped lower clamp ring, wherein the clamp ring body and the clamp ring are coupled to one another and together have a top end and a bottom end, the top end of the coupled structure being coupled to the bottom end of the electronics enclosure.
 4. The beam imaging sensor of claim 1, wherein the sensor body is formed from a metal or metal alloy.
 5. The beam imaging sensor of claim 1, wherein the sensor body is formed from aluminum, titanium, stainless steel, martensitic stainless steel, duplex and/or super duplex stainless steel; high austenitic alloys, nickel-based alloys, or titanium alloys.
 6. The beam imaging sensor of claim 1, wherein the Faraday cup is formed from a conductive metal or conductive metal alloy.
 7. The beam imaging sensor of claim 1, wherein the Faraday cup is formed from copper, silver, gold, platinum, aluminum, or a conductive metal alloy that contains one or more of copper, silver, gold, platinum, or aluminum.
 8. The beam imaging sensor of claim 1, wherein the plurality of sets of inner and outer slit plates are formed from a metal, metal alloy, or refractory material.
 9. The beam imaging sensor of claim 1, wherein the plurality of sets of inner and outer slit plates are formed from tungsten, molybdenum, hafnium, or an alloy that contains one or more of tungsten, molybdenum, or hafnium.
 10. The beam imaging sensor of claim 2, wherein the electronics enclosure is formed from an electrically non-conductive material.
 11. The beam imaging sensor of claim 2, wherein the electronics enclosure is formed from an organic-based or inorganic-based insulating compound, a glass-epoxy insulator, a ceramic insulator, or any combination of two or more thereof.
 12. The beam imaging sensor of claim 3, wherein the clamp ring body and lower clamp ring are independently formed from a metal or metal alloy.
 13. The beam imaging sensor of claim 3, wherein the clamp ring body and lower clamp ring are independently formed from a corrosion resistant metal or corrosion resistant metal alloy.
 14. The beam imaging sensor of claim 3, wherein the clamp ring body and lower clamp ring are independently formed from aluminum, titanium, stainless steel, martensitic stainless steel, duplex and/or super duplex stainless steel; high austenitic alloys, nickel-based alloys, and/or titanium alloys.
 15. The beam imaging sensor of claim 1, wherein the discontinuous partially circumferential slit is formed from at least three discontinuous portions over an arc length of about 90 to about 120 degrees.
 16. The beam imaging sensor of claim 1, wherein the discontinuous partially circumferential slit is formed from at least four discontinuous portions over an arc length of about 120 to about 180 degrees.
 17. The beam imaging sensor of claim 1, wherein the discontinuous partially circumferential slit is formed from at least six or more discontinuous portions over an arc length of about 200 to about 270 degrees.
 18. The beam imaging sensor of claim 1, wherein the discontinuous partially circumferential slit is formed from at least eight discontinuous portions over an arc length of about 270 to about 360 degrees.
 19. The beam imaging sensor of claim 1, wherein the plurality of sets of inner and outer slit plates are secured to the top end of the sensor body via a suitable number of anchor plates positioned at each end of a set of inner and outer slit plates.
 20. The beam imaging sensor of claim 1, wherein the plurality of sets of inner and outer slit plates are secured to the top end of the sensor body via a suitable number of anchor plates positioned at each end of a set of inner and outer slit plates, and where adjacent ends of adjacent sets of inner and outer slit plates are secured to the top end of the sensor body via the same anchor plate.
 21. A method for profiling an electron, or ion, beam using a beam imaging sensor comprising: (A) providing a beam imaging sensor having at least one slit; (B) providing a suitable electron, or ion, beam to be profiled; (C) providing a digital deflection control system and coil designed to deflect the electron, or ion, beam in a desired geometric path so as to sweep the electron, or ion, beam across the at least one slit in a straight path regardless of slit shape or geometry; (D) sweeping the electron, or ion, beam across at least one portion of the at least one slit of the sensor so as to generate data from the sensor; and (E) subjecting such data to at least one processing step using at least one computer so as to determine at least one electron, or ion, beam parameter.
 22. The method of claim 21, wherein the at least one parameter determined by the method is selected from beam power, beam cross-sectional shape or profile, beam energy distribution within the beam cross-sectional shape or profile, or combinations of two or more thereof.
 23. The method of claim 21, wherein the sweep pattern utilized in Step (D) is a substantially rectangular pattern.
 24. The method of claim 21, wherein the beam freefall position is parallel, but not coaxial, to the major axis of the sensor body and the beam freefall position is coincident with the slit.
 25. The method of claim 21 wherein the beam imaging sensor further comprises: a cylindrically-shaped electronics enclosure, wherein the electronics enclosure has a top end and a bottom end, the top end of the electronics enclosure being coupled to the bottom end of the sensor body.
 26. The method of claim 25, wherein the beam imaging sensor further comprises: a cylindrically-shaped clamp ring body and a cylindrically-shaped lower clamp ring, wherein the clamp ring body and the clamp ring are coupled to one another and together have a top end and a bottom end, the top end of the coupled structure being coupled to the bottom end of the electronics enclosure.
 27. The method of claim 21, wherein the sensor body is formed from a metal or metal alloy.
 28. The method of claim 21, wherein the Faraday cup is formed from a conductive metal or conductive metal alloy.
 29. The method of claim 21, wherein the sensor comprises at least one circumferential slit.
 30. The method of claim 21, wherein the sensor comprises at least one discontinuous partially circumferential slit. 